2017 IEEE 23rd International Symposium for Design and Technology in Electronic Packaging (SIITME)

2017 IEEE 23rd International Symposium for Design and Technology in Electronic Packaging (SIITME)

Detalles Bibliográficos
Formato: Electrónico Libro
Idioma:English
Publicado: IEEE
Subjects:
Components, Circuits, Devices and Systems; General Topics for Engineers; Photonics and Electrooptics; Power, Energy and Industry Applications; Robotics and Control Systems
Conference papers and proceedings.
Acceso en liña:Full text available on IEEE [2017-2023]
Off-campus access
Classic Catalogue: View this record in Classic Catalogue

Internet

Full text available on IEEE [2017-2023]
Off-campus access

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