2013 IEEE 19th International Symposium for Design and Technology in Electronic Packaging (SIITME)

2013 IEEE 19th International Symposium for Design and Technology in Electronic Packaging (SIITME)

Bibliographic Details
Format: Electronic Book
Language:English
Published: IEEE
Subjects:
Components, Circuits, Devices and Systems; Computing and Processing; Engineered Materials, Dielectrics and Plasmas; Photonics and Electrooptics
Conference papers and proceedings.
Online Access:Full text available on IEEE [2017-2023]
Off-campus access
Classic Catalogue: View this record in Classic Catalogue

Internet

Full text available on IEEE [2017-2023]
Off-campus access

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