2021 IEEE 27th International Symposium for Design and Technology in Electronic Packaging (SIITME)

2021 IEEE 27th International Symposium for Design and Technology in Electronic Packaging (SIITME)

Detaylı Bibliyografya
Materyal Türü: Elektronik Kitap
Dil:English
Baskı/Yayın Bilgisi: IEEE
Konular:
Components, Circuits, Devices and Systems; Engineering Profession; General Topics for Engineers; Power, Energy and Industry Applications; Robotics and Control Systems; Signal Processing and Analysis
Conference papers and proceedings.
Online Erişim:Full text available on IEEE [2017-2023]
Off-campus access
Classic Catalogue: View this record in Classic Catalogue

Internet

Full text available on IEEE [2017-2023]
Off-campus access

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