APA (7th ed.) Citation

Khan. (2013). Designing TSVs for 3D Integrated Circuits (1.). Springer New York.

Chicago Style (17th ed.) Citation

Khan. Designing TSVs for 3D Integrated Circuits. 1. Springer New York, 2013.

MLA (8th ed.) Citation

Khan. Designing TSVs for 3D Integrated Circuits. 1. Springer New York, 2013.

Warning: These citations may not always be 100% accurate.