Tong. (2013). Advanced Flip Chip Packaging (1.). Springer US.
Cita Chicago (17th ed.)Tong. Advanced Flip Chip Packaging. 1. Springer US, 2013.
Cita MLA (8th ed.)Tong. Advanced Flip Chip Packaging. 1. Springer US, 2013.
Atenció: Aquestes cites poden no estar 100% correctes.