Tong. (2013). Advanced Flip Chip Packaging (1.). Springer US.
Chicago Style (17th ed.) CitationTong. Advanced Flip Chip Packaging. 1. Springer US, 2013.
MLA (8th ed.) CitationTong. Advanced Flip Chip Packaging. 1. Springer US, 2013.
Warning: These citations may not always be 100% accurate.