Tan, C. Microelectronic Yield, Reliability, and Advanced Packaging. SPIE Digital Library.
Cita Chicago (17th ed.)Tan, Cherming. Microelectronic Yield, Reliability, and Advanced Packaging. SPIE Digital Library.
Cita MLA (8th ed.)Tan, Cherming. Microelectronic Yield, Reliability, and Advanced Packaging. SPIE Digital Library.
Atenció: Aquestes cites poden no estar 100% correctes.