Design, Characterization, and Packaging for MEMS and Microelectronics

Design, Characterization, and Packaging for MEMS and Microelectronics

Bibliografske podrobnosti
Drugi avtorji:	Courtois, Bernard
Format:	Elektronski Knjiga
Jezik:	English
Izdano:	SPIE Digital Library, 10/8/99
Teme:	Conference papers and proceedings.
Online dostop:	Full text available on Research4Life (SPIE Digital Library)
Classic Catalogue:	View this record in Classic Catalogue

Podobne knjige/članki

Design, Characterization, and Packaging for MEMS and Microelectronics II

MEMS Design, Fabrication, Characterization, and Packaging

Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS VI

Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS IV

Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS V

Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS VII

Microelectronics: Design, Technology, and Packaging

Education in Microelectronics and MEMS

Reliability, Packaging, Testing, and Characterization of MOEMS/MEMS and Nanodevices XII

Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS and Nanodevices X

Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS and Nanodevices XI

Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS and Nanodevices IX

Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS and Nanodevices VIII

Design, Process Integration, and Characterization for Microelectronics

Microelectronics: Design, Technology, and Packaging II

Microelectronics: Design, Technology, and Packaging III

Reliability, Packaging, Testing, and Characterization of MOEMS/MEMS, Nanodevices, and Nanomaterials XIII

Design, Test, Integration, and Packaging of MEMS/MOEMS

Design, Test, Integration, and Packaging of MEMS/MOEMS 2001

Design, Test, Integration, and Packaging of MEMS/MOEMS 2002

Design, Test, Integration and Packaging of MEMS/MOEMS, Symposium on

Device and Process Technologies for MEMS and Microelectronics

Reliability, Testing, and Characterization of MEMS/MOEMS

Microelectronic Packaging and Laser Processing

2012 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS

Microelectronic Structures and MEMS for Optical Processing III

Microelectronic Structures and MEMS for Optical Processing II

Device and Process Technologies for MEMS and Microelectronics II

Microelectronic Structures and MEMS for Optical Processing IV

Reliability, Testing, and Characterization of MEMS/MOEMS II

Reliability, Testing, and Characterization of MEMS/MOEMS III

Microelectronics and Packaging Conference, EMPC, European

Microelectronic Yield, Reliability, and Advanced Packaging

2018 Symposium on Design, Test, Integration & Packaging of MEMS and MOEMS (DTIP)

2020 Symposium on Design, Test, Integration & Packaging of MEMS and MOEMS (DTIP)

2021 Symposium on Design, Test, Integration & Packaging of MEMS and MOEMS (DTIP)

2013 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP)

2010 Symposium on Design Test Integration and Packaging of MEMS/MOEMS (DTIP)

2022 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP)

2014 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP)