Cita APA

2013 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP). IEEE.

Citación estilo Chicago

2013 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP). IEEE.

Cita MLA

2013 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP). IEEE.

Warning: These citations may not always be 100% accurate.