2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)

2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)

Dettagli Bibliografici
Natura: Elettronico Libro
Lingua:English
Pubblicazione: IEEE
Soggetti:
Components, Circuits, Devices and Systems; Engineered Materials, Dielectrics and Plasmas; Fields, Waves and Electromagnetics; Power, Energy and Industry Applications; Computing and Processing
Conference papers and proceedings.
Accesso online:Full text available on IEEE [2017-2023]
Off-campus access
Classic Catalogue: View this record in Classic Catalogue

Documenti analoghi

Documenti analoghi