2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)

2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)

Detalles Bibliográficos
Formato: Electrónico Libro
Idioma:English
Publicado: IEEE
Subjects:
Components, Circuits, Devices and Systems; Engineered Materials, Dielectrics and Plasmas; Fields, Waves and Electromagnetics; Power, Energy and Industry Applications; Computing and Processing
Conference papers and proceedings.
Acceso en liña:Full text available on IEEE [2017-2023]
Off-campus access
Classic Catalogue: View this record in Classic Catalogue

Internet

Full text available on IEEE [2017-2023]
Off-campus access

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