2010 5th International Microsystems Packaging Assembly and Circuits Technology Conference

2010 5th International Microsystems Packaging Assembly and Circuits Technology Conference

Detalles Bibliográficos
Formato:	Electrónico Libro
Lenguaje:	English
Publicado:	IEEE
Materias:	Components, Circuits, Devices and Systems; Engineered Materials, Dielectrics and Plasmas Conference papers and proceedings.
Acceso en línea:	Full text available on IEEE [2017-2023] Off-campus access
Classic Catalogue:	View this record in Classic Catalogue

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