Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems EuroSimE

Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems EuroSimE

Detalhes bibliográficos
Formato: Recurso Electrónico Livro
Idioma:English
Publicado em: IEEE
Assuntos:
Components, Circuits, Devices and Systems; Engineered Materials, Dielectrics and Plasmas; Fields, Waves and Electromagnetics; General Topics for Engineers; Communication, Networking and Broadcast Technologies; Computing and Processing; Power, Energy and Industry Applications
Conference papers and proceedings.
Acesso em linha:Full text available on IEEE [2017-2023]
Off-campus access
Classic Catalogue: View this record in Classic Catalogue

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