2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration

2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration

Dades bibliogràfiques
Format:	Electrònic Llibre
Idioma:	English
Publicat:	IEEE
Matèries:	Components, Circuits, Devices and Systems; Engineered Materials, Dielectrics and Plasmas; General Topics for Engineers; Computing and Processing Conference papers and proceedings.
Accés en línia:	Full text available on IEEE [2017-2023] Off-campus access
Classic Catalogue:	View this record in Classic Catalogue

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