Microelectronics and Packaging Conference, EMPC, European

Microelectronics and Packaging Conference, EMPC, European

Бібліографічні деталі
Формат:	Електронний ресурс Книга
Мова:	English
Опубліковано:	IEEE
Предмети:	Components, Circuits, Devices and Systems; Engineered Materials, Dielectrics and Plasmas; Computing and Processing Conference papers and proceedings.
Онлайн доступ:	Full text available on IEEE [2017-2023] Off-campus access
Classic Catalogue:	View this record in Classic Catalogue

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