Low Temperature Bonding for 3D Integration (LTB-3D), IEEE International Workshop on

Low Temperature Bonding for 3D Integration (LTB-3D), IEEE International Workshop on

Détails bibliographiques
Format:	Électronique Livre
Langue:	English
Publié:	IEEE
Sujets:	Components, Circuits, Devices and Systems; Engineered Materials, Dielectrics and Plasmas; General Topics for Engineers; Computing and Processing Conference papers and proceedings.
Accès en ligne:	Full text available on IEEE [2017-2023] Off-campus access
Classic Catalogue:	View this record in Classic Catalogue

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