2011 Symposium on Design, Test, Integration & Packaging of MEMS/MOEMS (DTIP)

2011 Symposium on Design, Test, Integration & Packaging of MEMS/MOEMS (DTIP)

Bibliografiske detaljer
Format:	Electronisk Bog
Sprog:	English
Udgivet:	IEEE
Fag:	Components, Circuits, Devices and Systems; Engineered Materials, Dielectrics and Plasmas; General Topics for Engineers Conference papers and proceedings.
Online adgang:	Full text available on IEEE [2017-2023] Off-campus access
Classic Catalogue:	View this record in Classic Catalogue

Lignende værker

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