Congress Molded Interconnect Devices (MID), International

Congress Molded Interconnect Devices (MID), International

Bibliografske podrobnosti
Format:	Elektronski Knjiga
Jezik:	English
Izdano:	IEEE
Teme:	Aerospace; Communication, Networking and Broadcast Technologies; Components, Circuits, Devices and Systems; Engineered Materials, Dielectrics and Plasmas; Engineering Profession; General Topics for Engineers; Power, Energy and Industry Applications Conference papers and proceedings.
Online dostop:	Full text available on IEEE [2017-2023] Off-campus access
Classic Catalogue:	View this record in Classic Catalogue

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