2022 IEEE 28th International Symposium for Design and Technology in Electronic Packaging (SIITME)

2022 IEEE 28th International Symposium for Design and Technology in Electronic Packaging (SIITME)

التفاصيل البيبلوغرافية
التنسيق: الكتروني كتاب
اللغة:English
منشور في: IEEE
الموضوعات:
Components, Circuits, Devices and Systems; Engineering Profession; General Topics for Engineers; Power, Energy and Industry Applications; Robotics and Control Systems; Signal Processing and Analysis
Conference papers and proceedings.
الوصول للمادة أونلاين:Full text available on IEEE [2017-2023]
Off-campus access
Classic Catalogue: View this record in Classic Catalogue

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