2022 17th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)

2022 17th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)

Detaylı Bibliyografya
Materyal Türü: Elektronik Kitap
Dil:English
Baskı/Yayın Bilgisi: IEEE
Konular:
Communication, Networking and Broadcast Technologies; Components, Circuits, Devices and Systems; Computing and Processing; Engineering Profession; Robotics and Control Systems
Conference papers and proceedings.
Online Erişim:Full text available on IEEE [2017-2023]
Off-campus access
Classic Catalogue: View this record in Classic Catalogue

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