2021 Symposium on Design, Test, Integration & Packaging of MEMS and MOEMS (DTIP)
| Format: | Elektronisch Buch |
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| Sprache: | English |
| Veröffentlicht: |
IEEE
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| Schlagworte: | |
| Online Zugang: | Full text available on IEEE [2017-2023] Off-campus access |
| Classic Catalogue: | View this record in Classic Catalogue |
| Beschreibung: | <strong>Off-Campus Access:</strong> Athens ID and Password Required <strong>On-Campus Access:</strong> No User ID or Password Required |
|---|---|
| Beschreibung: | 1 online resource |
| Format: | Mode of access: Internet |
| ISBN: | 978-1-6654-0230-9 978-1-6654-0231-6 |
| Zugangseinschränkungen: | Electronic access restricted to authorized BRAC University faculty, staff and students |