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Cita Chicago (17th ed.)2021 Symposium on Design, Test, Integration & Packaging of MEMS and MOEMS (DTIP). IEEE.
Cita MLA (8th ed.)2021 Symposium on Design, Test, Integration & Packaging of MEMS and MOEMS (DTIP). IEEE.
Atenció: Aquestes cites poden no estar 100% correctes.