2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
| Médium: | Elektronický zdroj Kniha |
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| Jazyk: | English |
| Vydáno: |
IEEE
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| Témata: | |
| On-line přístup: | Full text available on IEEE [2017-2023] Off-campus access |
| Classic Catalogue: | View this record in Classic Catalogue |