2019 International Conference on Electronics Packaging (ICEP)

2019 International Conference on Electronics Packaging (ICEP)

Bibliographische Detailangaben
Format: Elektronisch Buch
Sprache:English
Veröffentlicht: IEEE
Schlagworte:
Communication, Networking and Broadcast Technologies; Components, Circuits, Devices and Systems; Photonics and Electrooptics; Power, Energy and Industry Applications; Signal Processing and Analysis
Conference papers and proceedings.
Online Zugang:Full text available on IEEE [2017-2023]
Off-campus access
Classic Catalogue: View this record in Classic Catalogue
Beschreibung
Beschreibung:<strong>Off-Campus Access:</strong> Athens ID and Password Required
<strong>On-Campus Access:</strong> No User ID or Password Required
Beschreibung:1 online resource
Format:Mode of access: Internet
ISBN:978-1-7281-1710-2
978-4-9902-1887-4
Zugangseinschränkungen:Electronic access restricted to authorized BRAC University faculty, staff and students

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