Cita APA (7th ed.)

2019 6th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D). IEEE.

Cita Chicago (17th ed.)

2019 6th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D). IEEE.

Cita MLA (8th ed.)

2019 6th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D). IEEE.

Atenció: Aquestes cites poden no estar 100% correctes.