2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
| Format: | Electronic Book |
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| Language: | English |
| Published: |
IEEE
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| Subjects: | |
| Online Access: | Full text available on IEEE [2017-2023] Off-campus access |
| Classic Catalogue: | View this record in Classic Catalogue |