2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
| Formato: | Electrónico Libro |
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| Lenguaje: | English |
| Publicado: |
IEEE
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| Materias: | |
| Acceso en línea: | Full text available on IEEE [2017-2023] Off-campus access |
| Classic Catalogue: | View this record in Classic Catalogue |
| Notas: | <strong>Off-Campus Access:</strong> Athens ID and Password Required <strong>On-Campus Access:</strong> No User ID or Password Required |
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| Descripción Física: | 1 online resource |
| Formato: | Mode of access: Internet |
| ISBN: | 978-1-5386-8040-7 978-1-5386-8041-4 |
| Acceso: | Electronic access restricted to authorized BRAC University faculty, staff and students |