APA (7th ed.) Citation

2018 International Wafer Level Packaging Conference (IWLPC). IEEE.

Chicago Style (17th ed.) Citation

2018 International Wafer Level Packaging Conference (IWLPC). IEEE.

MLA (8th ed.) Citation

2018 International Wafer Level Packaging Conference (IWLPC). IEEE.

Warning: These citations may not always be 100% accurate.