2010 Symposium on Design Test Integration and Packaging of MEMS/MOEMS (DTIP)

2010 Symposium on Design Test Integration and Packaging of MEMS/MOEMS (DTIP)

Detalhes bibliográficos
Formato:	Recurso Electrónico Livro
Idioma:	English
Publicado em:	IEEE
Assuntos:	Communication, Networking and Broadcast Technologies; Components, Circuits, Devices and Systems; Computing and Processing; Engineered Materials, Dielectrics and Plasmas; Signal Processing and Analysis; Power, Energy and Industry Applications; Robotics and Control Systems Conference papers and proceedings.
Acesso em linha:	Full text available on IEEE [2017-2023] Off-campus access
Classic Catalogue:	View this record in Classic Catalogue

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