2017 International Conference on Electronics Packaging (ICEP)

2017 International Conference on Electronics Packaging (ICEP)

Bibliographic Details
Format: Electronic Book
Language:English
Published: IEEE
Subjects:
Communication, Networking and Broadcast Technologies; Components, Circuits, Devices and Systems; Photonics and Electrooptics; Power, Energy and Industry Applications; Signal Processing and Analysis
Conference papers and proceedings.
Online Access:Full text available on IEEE [2017-2023]
Off-campus access
Classic Catalogue: View this record in Classic Catalogue
Description
Item Description:<strong>Off-Campus Access:</strong> Athens ID and Password Required
<strong>On-Campus Access:</strong> No User ID or Password Required
Physical Description:1 online resource
Format:Mode of access: Internet
ISBN:978-1-5090-4888-5
978-4-9902188-3-6
Access:Electronic access restricted to authorized BRAC University faculty, staff and students

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