2010 11th International Conference on Electronic Packaging Technology & High Density Packaging

2010 11th International Conference on Electronic Packaging Technology & High Density Packaging

Библиографические подробности
Формат:	Электронный ресурс ‌
Язык:	English
Опубликовано:	IEEE
Предметы:	Components, Circuits, Devices and Systems; Engineered Materials, Dielectrics and Plasmas Conference papers and proceedings.
Online-ссылка:	Full text available on IEEE [2017-2023] Off-campus access
Classic Catalogue:	View this record in Classic Catalogue

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