ASME 2015 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems collocated with the ASME 2015 13th International Conference on Nanochannels, Microchannels, and Minichannels - Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales

Detalhes bibliográficos

Formato:	Recurso Electrónico Periódico
Idioma:	English
Publicado em:	ASME
Acesso em linha:	Full text available on ASME[2015-2015] Off-campus access