ASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems - Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes
| Format: | Electronic Journal |
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| Language: | English |
| Published: |
ASME
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| Online Access: | Full text available on ASME[2013-2013] Off-campus access |
| Item Description: | <strong>Off-Campus Access:</strong> Athens ID and Password Required <strong>On-Campus Access:</strong> No User ID or Password Required |
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| Physical Description: | 1 online resource |
| Format: | Mode of access: Internet |
| ISBN: | 978-0-7918-5575-1 |
| Access: | Electronic access restricted to authorized BRAC University faculty, staff and students |