ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1
| פורמט: | אלקטרוני כתב-עת |
|---|---|
| שפה: | English |
| יצא לאור: |
ASME
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| גישה מקוונת: | Full text available on ASME[2011-2011] Off-campus access |
פריטים דומים
- ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2
- ASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems - Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes
- ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems
- ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems
- ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems