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ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems

ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems

Detalhes bibliográficos
Formato: Recurso Electrónico Periódico
Idioma:English
Publicado em: ASME
Acesso em linha:Full text available on ASME[2021-2021]
Off-campus access
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Full text available on ASME[2021-2021]
Off-campus access

Registos relacionados

  • ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems
  • ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems
  • ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems
  • ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems
  • ASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems - Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems

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