ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems

ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems

Detaylı Bibliyografya
Materyal Türü:	Elektronik Dergi
Dil:	English
Baskı/Yayın Bilgisi:	ASME
Online Erişim:	Full text available on ASME[2019-2019 Off-campus access

Benzer Materyaller

ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems

ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems

ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems

ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems

ASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems - Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems

ASME 2015 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems collocated with the ASME 2015 13th International Conference on Nanochannels, Microchannels, and Minichannels - Volume 1: Thermal Management

ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1

ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2

ASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems - Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes

ASME 2015 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems collocated with the ASME 2015 13th International Conference on Nanochannels, Microchannels, and Minichannels - Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales

Photonics Packaging and Integration VI

Photonics Packaging and Integration IV

Photonics Packaging and Integration V

Photonics Packaging and Integration III

Intelligent Integrated Microsystems

2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC)

Photonics Packaging, Integration, and Interconnects IX

Photonics Packaging, Integration, and Interconnects VII

Photonics Packaging, Integration, and Interconnects VIII

Asia Communications and Photonics Conference and Exhibition

2019 14th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)

Microsystems, Packaging, Assembly and Circuits Technology (IMPACT), International

2019 International Conference on Electronics Packaging (ICEP)

Integrated Circuits and Microsystems (ICICM), International Conference on

Communications and Photonics Conference and Exhibition (ACP), Asia

2019 IEEE 4th International Conference on Integrated Circuits and Microsystems (ICICM)

Optoelectronic Interconnects VII; Photonics Packaging and Integration II

2016 International Conference on Integrated Circuits and Microsystems (ICICM)

2010 5th International Microsystems Packaging Assembly and Circuits Technology Conference

2011 Asia Communications and Photonics Conference and Exhibition (ACP)

Photonics and Microsystems. International Students and Young Scientists Workshop

2021 23rd European Microelectronics and Packaging Conference & Exhibition (EMPC)

2017 21st European Microelectronics and Packaging Conference (EMPC) & Exhibition

Science Exhibition 2019 at BRAC University
Yazar:: Monamee, Maisha Islam
Baskı/Yayın Bilgisi: (2019)

2019 IEEE International Workshop on Integrated Power Packaging (IWIPP)

2018 13th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)

2013 8th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)

2017 12th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)

2016 11th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)

2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)